Karl Suss FC 150 Flip Chip Bonder Sold

Asset # : 60163
Equipment Make: Karl Suss
Equipment Model: FC 150
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– UBA pressure: 200kg
– Arm chip maxsize: 100mm
– Chuck substrate size: 100mm
– Laser Auto-leveling
Equipment Pictures:
Karl Suss FC 150 Flip Chip Bonder 60163 Refurbished

Karl Suss FC 150 Flip Chip Bonder 60163 For Sale Online

Purchase Karl Suss FC 150 Flip Chip Bonder 60163

Karl Suss FC 150 Flip Chip Bonder 60163

Karl Suss FC 150 Flip Chip Bonder 60163 Image 1

Karl Suss FC 150 Flip Chip Bonder 60163 Image 2

Karl Suss FC 150 Flip Chip Bonder 60163 Image 3

Karl Suss FC 150 Flip Chip Bonder 60163 Image 4

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  • Added: May 26, 2021

  • Views: 894

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