Karl Suss FC 150 Flip Chip Bonder Sold

Asset # : 60163
Equipment Make: Karl Suss
Equipment Model: FC 150
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– UBA pressure: 200kg
– Arm chip maxsize: 100mm
– Chuck substrate size: 100mm
– Laser Auto-leveling

Equipment Pictures:

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  • Added: May 26, 2021

  • Views: 64

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