Datacon 8800 Quantum Flip Chip Bonder Sold

Asset # : 58196
Equipment Make: Datacon
Equipment Model: 8800 Quantum
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– No temperature option
– Flux dipping process
Equipment Pictures:
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  • Added: January 12, 2021

  • Views: 144

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