Datacon 8800 Chameo Dual Head Multi Flip Chip Bonder Sold

Asset # : 57228
Equipment Make: Datacon
Equipment Model: 8800 Chameo
Type: Dual Head Multi Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– w/ IPU2602x image processing unit
– ETX 1.1 control computer

Equipment Pictures:

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  • Added: October 9, 2020

  • Views: 469

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