Panasonic 2559 MB High Speed Chip Component Mounting Machine

Asset # : 56958
Equipment Make: Panasonic
Equipment Model: 2559 MB
Type: High Speed Chip Component Mounting Machine
Wafer Size:
Equipment Configuration:

– 3 Phase
– 200 Vac, 50/60 Hz, 7kVA
– Air: 0.5 MPa, 100 L/min
– 12 Heads on a Torret System (5 Different Nozzle Types per Head)
– Components ranging from 1005 (0402) to 32×32 mm QFP
– Q-Type Feeders with 150+150 Max Inputs of 8mm Double Feeders
– Transmissive and Reflective Recognition System
– Applicable PCB
Dimensions:
– Max 510mm x 460 mm
– Min 50mm x 50 mm
Placement Area
– Max 510 mm x 452 mm
– Min 50mm x 42 mm
Thickness
– 0.5 to 4.0mm
PCB Warp Tolerance
– 0.5mm for Downward and 1.2mm for Upward Directions
Placement Accuracy: 0.10mm
Applicable Component and Packaging
– Embossed Taped Components
– Chip and Cylindrical Components, Tantalum Cap (A,B,C,D)
– Alum Elec Cap, SOT, SOD, SO, SOP, QFP
– Paper Taped Components
– Chip Components 1005 to 3216 (0402 to 1206)
Component Dimension Limitation
– Min 1005 and Max 32mm x 32mm
– Component Height: Max 6mm
– Lead Pitch: Min 0.65mm

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  • Added: October 9, 2020

  • Views: 101

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