Datacon PPS 2211 Multichip Die Bonder

Asset # : 56277
Equipment Make: Datacon
Equipment Model: PPS 2211
Type: Multichip Die Bonder
Wafer Size:
Equipment Configuration:

– Chip thickness: 90-150um

Equipment Pictures:

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Ad Details

  • Added: October 9, 2020

  • Views: 219

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