EVG 520 IS UV NIL Bonder

Asset # : 53001
Equipment Make: EVG
Equipment Model: 520 IS
Type: UV NIL Bonder
Wafer Size: 8"
Equipment Configuration:

– Max Overpressure: 1 Atmosphere for Contactless Pressurization of Pre-Bonded Wafer Pairs
– Max Contact Force Created by One Atmosphere Pressure Differential (<14.5 PSI) - Atmospheric Capabilities down to 1 x 10 -1 mbar (7.5 x 10 -2 Torr) - Pump Time Capability < 1min from 1000 to 5 mbar - Purge Time Capability < 10sec from high vacuum to 1 bar - Heating Capability on Bottom Side Heater - 1 UV-Lightsource - 400W Light Source for UV-adhesive Curing (wave length 300-500 nm) - Operations manual and documentation

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  • Added: October 9, 2020

  • Views: 386

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