Asset # : 46727
Equipment Make: Applied Materials
Equipment Model: Raider GT
Type: Copper (Cu) Plating
Wafer Size: 8"
Equipment Configuration: - Single-wafer - Automated electrochemical deposition - 4 TSV chambers - Pre-wet vacuum chamber - 2 SRD champbers - Copper edge bid removal chamber - 2 basic plating chambers - Multi-zone anode array - Incorporated RTA (real-time analytical) system
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  • Added: May 21, 2019

  • Views: 24

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