ESEC 3088 Ball Wedge Bonder
Asset # :
44941
Equipment Make:
Esec
Equipment Model:
3088
Type:
Ball Wedge Bonder
Wafer Size:
Equipment Configuration:
– Max Bonding Area: 52x70mm
– Dimensions (mm) 800.5 x 1000 x 1700
– Weight (kg): 520
– 130 Khz
Equipment Pictures:
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Added: February 21, 2019
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Views: 281