Ulvac CE 300 i RIE Machine

Asset # : 33881
Equipment Make: Ulvac
Equipment Model: CE 300 i
Type: RIE Machine
Wafer Size: - Load Lock - RF discharge source - Inductive Coupled Plasma (ICP) - RF frequency : 13.56MHz RF power - ICP assembly upper electrode: Max 1000W - RF biased lower electrode: Max 300W Control of discharge impedance - Auto Purge gas: N2* Temperature control of sample substrate: water circulator and He gas Wafer hold type - Electrostatic chuck Target materials : Mo, TiN, NbN, Si* Wafer tray: quartz " - Gasses: SF6, CF4, C4F8, O2 - Available for automatic recipes - Abatement Pump
Equipment Configuration:

3″

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  • Added: April 2, 2018

  • Views: 19

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