Toray Engineering FC 2000 US Flip Chip Bonder
Asset # :
32679
Equipment Make:
Toray
Equipment Model:
FC 2000 US
Type:
Flip Chip Bonder
Wafer Size:
Equipment Configuration:
Equipment Pictures:
Send BTG Message:
InquireAd Details
-
Added: April 20, 2021
-
Views: 1307