Disco DFG 8540 InFeed Surface Grinder
Asset # :
23364
Equipment Make:
Disco
Equipment Model:
DFG 8540
Type:
In-Feed Surface Grinder
Wafer Size:
Up to 8"
Equipment Configuration:
– Automated thinning up to 200 mm diameter wafers
– Ultra-thin wafer handling to 100 µm and less
– DBG option available and Plasma-ready
– Flat/Notch alignment orientation
– Interior grind water nozzle
– Chuck/Spinner table
– Positioning and stopping
Equipment Pictures:
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Added: February 26, 2018
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Views: 102