Disco DFG 8540 InFeed Surface Grinder

Asset # : 23364
Equipment Make: Disco
Equipment Model: DFG 8540
Type: In-Feed Surface Grinder
Wafer Size: Up to 8"
Equipment Configuration:

– Automated thinning up to 200 mm diameter wafers
– Ultra-thin wafer handling to 100 µm and less
– DBG option available and Plasma-ready
– Flat/Notch alignment orientation
– Interior grind water nozzle
– Chuck/Spinner table
– Positioning and stopping

Equipment Pictures:

Send BTG Message:

Inquire

Ad Details

  • Added: February 26, 2018

  • Views: 102

Description

Tags :