Disco DFG 8540 InFeed Surface Grinder

Asset # : 23364
Equipment Make: Disco
Equipment Model: DFG 8540
Type:
Wafer Size: - Automated thinning up to 200 mm diameter wafers - Ultra-thin wafer handling to 100 µm and less - DBG option available and Plasma-ready - Flat/Notch alignment orientation - Interior grind water nozzle - Chuck/Spinner table - Positioning and stopping system - 2 spindles, 3 rotary-chuck table
Equipment Configuration:

Up to 8″

Equipment Pictures:

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Ad Details

  • Added: February 26, 2018

  • Views: 32

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