Asset # : 20127
Equipment Make: KDF MRC
Equipment Model: 643 P
Type: In-Line Sputtering System
Wafer Size:
Equipment Configuration:

– Three Cathode System — Two DC Magnetron Cathodes Installed
– 13″ x 13″ Substrate Pallet
– Load Lock Heating
– Process Heating
– DC Bias
– RF Bias
– 208 V
– 100.0 A
– 50/60 Hz
– 3 Phase

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  • Added: February 14, 2019

  • Views: 308

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