ASML Twinscan XT 1250 D ArF Scanner
- 193nm
- Track Pre-warning signal (APR)s: APR enabled - Avoid Track INPUT/OUTPUT conflicts, Raise AS after APRs: Avoid Track - INPUT/OUTPUT conflicts enabled - Active wafer release for dry WSs: FALSE - Closing disk types: No closing disk present - Safeguard to prevent loading of reticles with too wide or mispositioned pellicles: Disabled Continuous clampable wafer table for dry WSs: Absent - Type of wafer table on chuck 1 & 2 for immersion machines: Zerodur version 1 - WS Immersion throughput packages: None - WS Immersion thermal control packages: None - Wafer Stage Configurations: Wafer Stage type 2 configuration - Wafer Carrier Locations: Right - Wafers per Carriers: 25 - Wafer Mark Sensors: Absent - Wafer Id Readers: Absent - Wafer Tracks: Present - Wafer Stage Types: Dual Chuck - Wafer Stress Relaxations: FALSE - Lower Docking Plates: Present - WS Balance Masss: Stainless Steel - WH Robot Power Amplifiers: CPM 20 - Wafer Stage Fast Stiff X Move Electronics: Present - Wafer Stage Mirror Block Down Electronics: Present - Universal Prealignments: Disabled - Interferometer axis version at exposures: 3 plus 1 axis - Wafer Handling Pneumaticss: Dedicated - Wafer Switchs: Absent - Chuck 1 & 2 wafer sizes: 300mm - Type of immersion hood for immersions: None - Specifies chuck1 & 2 layout relev. for Immersions: Chuck does not support immersion Specifies chuck1 & 2 configs: Dry - Specifies chuck1 & 2 versions: not specified - Changed Short Stroke diff XY controllers: Disabled - Docking wheels at WH unloads: Present - Docking plate heights: Low - Immersion Hood versions: Absent
- Carrier Handler Types: Mark I 300 Foup - Wafer Handling Load & Unload Robot Types: Double Fold Arm, 12 mm Z stroke - Wafer Handling Store Units: Absent - Wafer Handler wrt BF Shifted in Zs: Not Shifted - Reticle streaming lites: Disabled - Enhancements in Reticle Monitors: no enhancements - Reticle streaming: Disabled - Improvements for reticle handlings: Disabled - Extend IRIS maximum particles scanned to 50000.s: Absent - Zeroing type for Encoders Measurement Systems: Using extra hall sensors for zeroing Reticle Stage Chuck Types: Glued Leafspring, TYPE_2: Glued LS, Pneum. GC, IFM / ENC Nitrogen purging of Reticle Stages: RS is not purged - Reticle Carrier Locations: Right - Integrated Reticle Inspection Systems: PPD1 with IRIS1 functionality - Integrated Reticle Librarys: IRL with original functionality - Reticle Sizes: 6 inch - Reticle Carrier Tag Readers: Present - Reticle Stage Long Stroke Motor Types: Cobalt Ferro 18 teeth - Reticle Stage Long Stroke Configs: TYPE_3:CoFe_18 motor, SB controlled, int. vacuum supply, pneum GC - Automated Reticle Transport Systems: Absent - Reticle Stage Lenscooler Boxes: Lenscooler Box with anti-aliasing Filter - Maximum Reticle ID Lengths: 24 Characters - Reticle Stage Measurement System on Scans: Heidenhain Encoders - Relative direction of ws to rs on the X axiss: Same - RS Object Fields: Normal - Reticle exchange types: Retex option: E Iris feature Scans: Absent (Overrules Absent) - Reticle Handler types: Original 2D Barcode Readers: Absent - Integrated Reticle Inspection System Configurations: Disable creation of OSIRIS viewable files. - WS Immersion Hood Only Testrigs: Absent - Version of RS/WS IO librarys: Version 1 - Dynamic Performance Calculations: Mark 1 - Stages Sample Rates: 5.0 kHz - Interferometer Electronics: Ifsr - Capacitive z-height sensor type.s: Dual Z sensor board - Ifm config at measure sides: 8 axes - Dose System Performance Test sequences: Test sequence 1 - PEP-ADC Intensitys: Disable PEP-ADC Intensity - Online Lamp Peak: Disable Online Lamp Peak - Dose Intensity Optimizations: Dose Intensity Optimization
- Carrier Handler Types: Mark I 300 Foup - Wafer Handling Load & Unload Robot Types: Double Fold Arm, 12 mm Z stroke - Wafer Handling Store Units: Absent - Wafer Handler wrt BF Shifted in Zs: Not Shifted - Reticle streaming lites: Disabled - Enhancements in Reticle Monitors: no enhancements - Reticle streaming: Disabled - Improvements for reticle handlings: Disabled - Extend IRIS maximum particles scanned to 50000.s: Absent - Zeroing type for Encoders Measurement Systems: Using extra hall sensors for zeroing Reticle Stage Chuck Types: Glued Leafspring, TYPE_2: Glued LS, Pneum. GC, - IFM / ENC Nitrogen purging of Reticle Stages: RS is not purged - Reticle Carrier Locations: Right Integrated Reticle Inspection Systems: PPD1 with IRIS1 functionality - Integrated Reticle Librarys: IRL with original functionality - Reticle Sizes: 6 inch - Reticle Carrier Tag Readers: Present - Reticle Stage Long Stroke Motor Types: Cobalt Ferro 18 teeth - Reticle Stage Long Stroke Configs: TYPE_3:CoFe_18 motor, SB controlled, int. vacuum supply, pneum GC - Automated Reticle Transport Systems: Absent - Reticle Stage Lenscooler Boxes: Lenscooler Box with anti-aliasing Filter - Maximum Reticle ID Lengths: 24 Characters - Reticle Stage Measurement System on Scans: Heidenhain Encoders - Relative direction of ws to rs on the X axiss: Same - RS Object Fields: Normal - Reticle exchange types: Retex option: E - Iris feature Scans: Absent (Overrules Absent) - Reticle Handler types: Original - 2D Barcode Readers: Absent Integrated Reticle Inspection System Configurations: Disable creation of OSIRIS viewable files. - WS Immersion Hood Only Testrigs: Absent - Version of RS/WS IO librarys: Version 1 - Dynamic Performance Calculations: Mark 1 - Stages Sample Rates: 5.0 kHz - Interferometer Electronics: Ifsr - Capacitive z-height sensor type.s: Dual Z sensor board - Ifm config at measure sides: 8 axes - Dose System Performance Test sequences: Test sequence 1 - PEP-ADC Intensitys: Disable PEP-ADC Intensity - Online Lamp Peak: Disable Online Lamp Peak - Dose Intensity Optimizations: Dose
- Intensity Optimization
- Test Table Z Axiss: Worm Wheel - PUPICOMs/ Architectures: Present/ DC Motor with gearbox Number of Z Lens Manipulatorss: 5 - Number of Active Lens Elementss: 1 - Number of Bi-directional Active Lens Elementss: 0 - Number of Active Manipulator Elementss: 0 - Number of Active Elementss: 1 - Number of Half Dome Mirrorss: 0 - Number of Semi-Active X-Y Lens Manipulatorss: 4 - Setup sensor board versions: Setup SSD version 1 - Imaging Generic Power Amplifiers: Generic Power Amplifier Imaging Control Rack Configurations: IPDR - Type of projection multiplexer boards: MUX Absent - LEC Rack in Electronic Architectures: Present - Projection GPA Configuration Versions: Version 2 - Number of Lens NEXZ Manipulatorss: 5 - Number of Lens Z Manipulators Using Camdisks: 0 Spotsensor surface coatings: Bilatal - Energy Sensors: VLOC - Spot Sensor Chuck 1s & 2s: VLOC - Modelling for MAXYSs: Absent - Uniformity Improvement Packages: Present - Number of pre-amps available per Z-manipulators: 0 Immersions: Absent - Pupil measurements with ILIASs: Present - Automatic CUAs: Absent - Beam Controls: Beam adjustment - Extended Spot Sensor Matchings: Present - Number of Rxms/ Ryms: 5/5 - Diaphragm Limiters: Absent - NA1 motor types: None - Spot Sensor Reticle Stages: Absent - Smooth Field Uniformitys: Absent - Exchangeable Last Lens Elements: Present - Exchangeable Pupil Lens Elements: Absent - Number of manipulable ELLE axess: 0 - UV Shutter versions: UV Shutter version 1 - Dosecontrol Hardwares: ISB - Illuminator platforms: Aerial 2 - Polarizations: Absent - Automatic PCE exchangers: Absent - Automatic CUA exchanger architectures: Not applicable Test table architectures: Aerial 2
- Illumination modes: All illumination modes - DUV Lightsource Power Levels: 45.00 Watt - Lens Top Tool Connections: Lens Top Tool can be mounted on top of the Lens Scanning Energy Sensor Calibrations: Static Energy Sensor Calibration - Position of Spot Sensor on Chuck 1s: Spot - Sensor Position on Chuck 1 layout 1 Position of Spot Sensor on Chuck 2s: Spot Sensor Position on Chuck 2 layout 1 - Z-capture for low relfectivity wafers: Off - TIS plate deformation corrections: Disabled - FSM Flexibility packages: Disabled - Field width optimised leveling: Disabled - Constrained fits: Disabled - Levelling throughput improvement on measure sides: No levelling throughput package Point-to-Point LS Machine Matchings: Disabled - Circuit Dependent FECs: Present - Focus Monitorings: Present - Extended LS areas: Disabled - Air Gauges: Absent - Type of Air Gauges: No Air Gauge device present - Reticle shape corrections: Disabled ( Overrules Enabled ) - LS focus nodes: LS focus node 3 - Level Sensor Processing Racks: LCSR - LS_PEMM_CONFIGs: Present - LS_CPU_CONFIGs: 3 CPU's available - Base Liner overlay high order intrafields: Disabled - BaseLiner focus high order intrafields: Disabled - BaseLiner focus control.s: Disabled - Pattern Matcher fullchips: Absent - Pattern Matchers: Absent - Maximum numerical aperature (NA) that can be used in Lot Productions: level 0 - Log missed translations: Disabled - Allow even orders usages: Present - Multilingual UIs: Absent - Improved Maintenance action scheduling.s: Disabled - Recipe Creators: Light - Lot Report Data Categorys: Enhanced Diagnostics - CDCs: Enabled - EFESEs: Absent - PED control modes: Absent - Proximity Matchings: Present mbds controls: Present - Enhanced exposures 1s: Present - Data collection not covered by FOCUS and - OVERLAYs: InformPro Data Collection disabled
- Overlay Data Collections: Disabled - XML Lot Report Content Levels: Basic - Enable the Maintenance Assistants: Disable Maintenance Assistant - EDA Interfaces: Disabled - Equipment Constants via SECS interfaces: Disabled - LCI WaitWatcher plug-ins: Absent - Reorder Lot Services: Absent - Shot Data Collections: Absent - Focus Data Collections: Absent - Alignment Recipe Overrides: Disabled - Enable to support SMASH XY mark types.s: not supported - Specifies which mark types are supporteds: ASML marks only - Alignment laser configurations: 2 color laser - OADB Improved Dynamic Ranges: Disabled - Board configurations: ODB + ADB - Alignment Camera Mirrors: Absent - Athena Narrow Marks Twinscans: Present - Alignment Sensor Types: Athena Narrow Marks OM - Athena Focus Improvements 1s: Present - Max alignment speeds: Setting 2 - AA processing racks: AACR processing rack - Particle Extraction Mass Flow Meters: Absent purging configurations: purging CONFIG 3 - Bubble Extraction Seal Settings: Not Applicable - Ultra Pure Water flow controller (WICC)s: absent - LCW Circuit set-ups: Flow Version 1 - In situ Wafer TablesStone Cleanings: Absent - Clean Air Configurations: Others - Metroframe Circuit Water Cabinets: Absent - CT Miscellaneous Racks: Present - Clean Air Temperature Controls: Driver and ACC - Purge Hoods configurations: Compressed Clean air and Extremely Clean Dry air Nitrogen Purge Utility Controls: Absent - Reticle Cleanings: Absent - Metroframe types: TYPE_I - Inlet restriction for clean airs: Inlet restriction at right side - Reticle Stage purged mini environments: Present - Gas Control Unit Types: High Flow (HF) - Wet Imaging Control Cabinets: Not Applicable - Readout location of Pneumatic Facility Unit sensors: Machine Base Diagnostics System (MBDS) - Laminar Bottom Hoods: Absent - Extreme Clean Humiditied Airs: Absent
- Lens Circuit Water Flows: High - Motor Circuit Water Flows: Normal - SPM temp correction for lens axiss: Disabled - 2 Sided IFM-beams for WS-X (expose/ measure)s: Not available - Diff pressure correction for IFM beams: Absent - IFM Laser Configurations: AOM Recombo Laser - Position Control Rack Configurations: Rack Configuration type 3 - Position Control Power Rack Configurations: TYPE_3: Stages Power Rack upto E-spec Number of Motion Controllerss: 5 Motion Controllers present - Position Control Motion Control racks: PMCR - Reticle Stage Short Stroke X/Y11/Y12/Y21/Y22/Y11/Y11 amp.s: PADC 100V/16A Wafer Stage Short Stroke 1 XY1/ XY2/XY3 amp.s: PADC 100V/16A - Wafer Stage Short Stroke 2 XY1/ XY2/XY3 amp.s: PADC 100V/16A - Reticle Stage Short Stroke Z1/Z2/Z3 amp.s: Pass Low Current 8.5A - Wafer Stage Short Stroke 1 Z1/Z2/Z3 amp.s: Pass Low Current 8.5A - Wafer Stage Short Stroke 2 Z1/Z2/Z3 amp.s: Pass Low Current 8.5A - Reticle Stage Long Stroke Y11/Y12/Y21/Y22 amp.s: 450V20A: PAAC AT-pepD Reticle Balance Mass 1/2 amp.s: 450V20A: PAAC AT-pepD - Wafer Stage Long Stroke E/M X amp.s: 400V16A: PAAC AT-D - Wafer Stage Long Stroke E Y1/Y2/CS amp.s: 400V16A: PAAC AT-D - Wafer Stage Long Stroke M Y1/Y2/CS amp.s: 400V16A: PAAC AT-D - Wafer Stage Balance Mass 11/12/21/22 amp.s: 325V14A: PAAC AT-C - Pressure update rate for fringelength corrections: Pressure update rate 2 or 4 Hz - TestStreams: TestStream disabled - Performance Enhancement Packages: None - PEP Image Streamings: Present - Lot Overhead Reductions: LOR2 - Extended Zone Alignments: Disabled - Intrafield Higher Order Process Correctionss: Disabled - SMASH Reuse Capture Information in Stage Alignments: Coarse capture scans are done on all stage alignment marks. - Allow wafer plane deviation check with Focus Monitorings: Disabled - Parameter indicates how long overlay data will be stored.s: Short retention period. Level sensor Ry drift corrections: Disabled - Fading Control Switchs: Disabled - Improved wafer reject modes: Disabled - Automated Lens Heating Calibrations: Disabled - Lens heating History in LH Feedforwards: Enabled - Allow different Exp,TIS Align sets: Absent - Imaging Fading Controls: Disabled - Gridmappers: Disabled - 2D grid corrections: Enabled - Double TIS scans: Disabled
- Symmetrical Reticle Alignments: Disabled - Ast offset correction in TIS LHFB/LOCO (Version 3)s: Enabled - Choice of avoidance routing.s: Absent - NEXZ-tilt per exposures: The NEXZ-tilt cannot be adjusted per exposure. - Off-axis slits: Projection lens has no off-axis slit. - Improved Edge Field Levelings: Disabled - Enhanced Throughput Reticle Alignments: Present - Wavelength Adjustables: Adjustable - Allow L1L7 Type 1 Optimizations: Absent - Lot Alignment Report Encryptions: Unencrypted - Stage Alignment Filters: Present - Lot Correction Sequences: Unencrypted - Stage Alignment Filters: Present - Lot Correction Sequences: Type B - Lens Heating Feedbacks: Present - Application Specific Lens Heating Calibration and Verifications: Present Improved Contrast Controls: Absent - ILIAS lens setups: Absent - Air Gauge Improved Levellings: Absent - Process Dependent Gain Corrections: Absent - Enhanced Exposure Overlays: Absent - ALE 1 Uses: Lens heating only - Overlay Nodes: Level 0 - E-chuck Flatness Qualification Tests: Disabled - TOP HDs: Absent - Reticle Align High Precisions: Absent - LS spot coverages: Absent - Layout Version Number TIS Plate 1 on Chuck 1s/2s: TIS Plate 1 Layout Version 2 Layout Version Number TIS Plate 2 on Chuck 1s2s: TIS Plate 2 Layout Version 4 Usage of wavelength/ Energy Sensor data by TISs: Disabled - Indication what kind of AM controller hardware is presents: SUCR - Piezo Active Lens Mountss: Absent - ILIAS Functionality For Lithoguides: Present - ISIS Functionality For Lithoguides: Absent - SAMOS Stray Light Test For Lithoguides: Present - PUPIL Measurement For Lithoguides: Present - FOCAL Measurement for Lithoguides: Present - Leveling Verification Test for Lithoguides: Present - Lithoguide Imaging Recipess: Absent - Dose System Performance Test for Lithoguides: Present - ILIAS Sensor Locations: Chuck 2 - ILIAS sensor type chuck 2s: Multiple scan grid - ILIAS sensor type chuck 1s: None
- Reticle Level Polarization Sensors: Absent - SASO robustness and fiber connectivitys: Disable SASO robustness - Extended X width masking ranges: Disabled - PDO offset for EFL LS spots: Disabled - Assure System Snapshotss: not allowed - Insert a delay time before starting a Lot (lens heating).s: Enabled - Save throughput data to the disks: Disabled - Patch strategys: Patchlevel - Chuck Dedications: Basic - Application Types: Scanner Application - Number of RMCS clients: No clients - MDL Viewers: Site View - ZERO Fiducials: ILIAS MK2 - Machine Architectures: XT Machine Architecture - XT Architecture Revisions: Rev1 - Machine Types: 1250 - Machine Specifications: pep-D Specification - Stand-alone Workstations: FALSE - CP 1As/1Bs/2s/3s/4s/5s/6s: Absent - Wafer Handler Productivitys: Level 0
2004 Vintage