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25001 products
| Asset # | Image | Title | Make | Model | Type | Wafer Size |
|---|---|---|---|---|---|---|
| 158310 |
|
KLA FLX 2320 Thin Film Stress Measurement System |
KLA | FLX 2320 | Thin Film Stress Measurement System | - |
| 158304 |
|
CTI On-Board 400 Cryo Pump |
CTI | On-Board 400 | Cryo Pump | - |
| 158303 |
|
Electroglas 4090 u+ Prober |
Electroglas | 4090 u+ | Prober | - |
| 158302 |
|
ONTO / Rudolph MetaPulse 200 XCu Film Thickness Measurement |
ONTO / Rudolph | MetaPulse 200 XCu | Film Thickness Measurement | 8 inch |
| 158301 |
Sold
|
Strasbaugh 7 AF Wafer Grinder |
Strasbaugh | 7 AF | Wafer Grinder | - |
| 158299 |
|
K&S IConn Plus Wire Bonder |
K&S | IConn Plus | Wire Bonder | - |
| 158300 |
|
Hitachi S 9220 SEM (Scanning Electron Microscope) |
Hitachi | S 9220 | SEM (Scanning Electron Microscope) | 6, 8 inch |
| 158296 |
|
K&S IConn Plus Wire Bonder |
K&S | IConn Plus | Wire Bonder | - |
| 158292 |
|
Strasbaugh 7 AF Edge Grinder |
Strasbaugh | 7 AF | Edge Grinder | - |
| 158288 |
|
Nordson / Dage Series 4000 PAXY Bond Tester |
Nordson / Dage | Series 4000 PAXY | Bond Tester | - |
| 158289 |
|
ESPEC BTZ 175 Benchtop Temperature Test Chamber |
ESPEC | BTZ 175 | Benchtop Temperature Test Chamber | - |
| 158287 |
|
Nordson / Asymtek Spectrum II S 2 910 Precision Fluid Dispenser |
Nordson / Asymtek | Spectrum II S 2 910 | Precision Fluid Dispenser | - |
| 158286 |
|
ESPEC TSE 12 A Thermal Shock Chamber |
ESPEC | TSE 12 A | Thermal Shock Chamber | - |
| 158283 |
|
Besi / Datacon 2200 evo advanced Die Bonder |
Besi / Datacon | 2200 evo advanced | Die Bonder | - |
| 158285 |
|
K&S Maxum Ultra Wire Bonder |
K&S | Maxum Ultra | Wire Bonder | - |
| 158281 |
|
Semitool SST 421 Spray Solvent Tool (SST) |
Semitool | SST 421 | Spray Solvent Tool (SST) | - |
| 158277 |
|
PVA 650 Coating / Dispensing |
PVA | 650 | Coating / Dispensing | - |
| 158274 |
|
KLA P/N: 28-0115 Xenon Lamp Power Supply |
KLA | P/N: 28-0115 | Xenon Lamp Power Supply | - |
| 158269 |
|
Disco DTG 8440 Taiko Grinder |
Disco | DTG 8440 | Taiko Grinder | - |
| 158268 |
|
inTEST Cobal 250 Manipulator |
inTEST | Cobal 250 | Manipulator | - |
| 158267 |
|
Nordson / Dage 4000 TPAXY Bond Tester |
Nordson / Dage | 4000 TPAXY | Bond Tester | - |
| 158266 |
|
Nikon Eclipse L 200 D Inspection Microscope |
Nikon | Eclipse L 200 D | Inspection Microscope | - |
| 158265 |
|
SRD (Spin Rinse Dryer) |
- | - | SRD (Spin Rinse Dryer) | - |
| 158264 |
|
KLA / Toho FLX 2320 S Thin Film Stress Measurement |
KLA / Toho | FLX 2320 S | Thin Film Stress Measurement | - |
| 158263 |
|
Nikon VMR 6555 Vision Measuring System |
Nikon | VMR 6555 | Vision Measuring System | - |
| 158262 |
|
Beneq P 400 A 028 ALD (Atomic Layer Deposition) |
Beneq | P 400 A 028 | ALD (Atomic Layer Deposition) | - |
| 158258 |
|
Besi / Esec 2100 FC Plus Die Bonder |
Besi / Esec | 2100 FC Plus | Die Bonder | - |
| 158257 |
|
Besi / Esec 2100 FC Die Bonder |
Besi / Esec | 2100 FC | Die Bonder | 8 inch |
| 158256 |
|
ASM AD 838 L Die Bonder |
ASM | AD 838 L | Die Bonder | - |
| 158248 |
|
Electroglas 4090 u+ Prober |
Electroglas | 4090 u+ | Prober | - |
| 158247 |
|
Hesse & Knipps (H&K) BJ 820 Bonder |
Hesse & Knipps (H&K) | BJ 820 | Bonder | - |
| 158246 |
|
Nordson / Dage BT 4000 W Bond Tester |
Nordson / Dage | BT 4000 W | Bond Tester | - |
| 158245 |
|
Lam / SEZ SP 203 Spin Etcher |
Lam / SEZ | SP 203 | Spin Etcher | 6 inch |
| 158243 |
|
Hirayama PC 702 R 8 HAST / PCT Chamber |
Hirayama | PC 702 R 8 | HAST / PCT Chamber | - |
| 158238 |
|
Teradyne J 750 ATE (Automatic Test Equipment) |
Teradyne | J 750 | ATE (Automatic Test Equipment) | - |
| 158229 |
|
Applied Materials Endura 2 PVD (Physical Vapor Deposition) |
Applied Materials | Endura 2 | PVD (Physical Vapor Deposition) | 4, 6 inch |
| 158235 |
|
Strasbaugh 6 UR 4 Spindle Polisher |
Strasbaugh | 6 UR 4 | Spindle Polisher | - |
| 158232 |
|
Brown & Sharpe PFx 7105 CMM (Coordinate Measuring Machine) |
Brown & Sharpe | PFx 7105 | CMM (Coordinate Measuring Machine) | - |
| 158231 |
|
Pfeiffer / Alcatel Adixen AMS 200 DRIE (Deep Reactive Ion Etch) |
Pfeiffer / Alcatel | Adixen AMS 200 | DRIE (Deep Reactive Ion Etch) | 8 inch |
| 158228 |
|
KLA PN: 54-0387 Lower Stage Interface PCA |
KLA | PN: 54-0387 | Lower Stage Interface PCA | - |
| 158226 |
|
K&S 982-6 Saw |
K&S | 982-6 | Saw | - |
| 158210 |
|
ASM AD 838 L Die Bonder |
ASM | AD 838 L | Die Bonder | 8 inch |
| 158202 |
|
ASM MCM 12 Die Bonder |
ASM | MCM 12 | Die Bonder | - |
| 158198 |
|
ESPEC SH 241 Environmental Chamber |
ESPEC | SH 241 | Environmental Chamber | - |
| 158196 |
|
KLA HRP 340 Surface Profilometer |
KLA | HRP 340 | Surface Profilometer | 8, 12 inch |
| 158197 |
|
ESPEC LHU 113 Humidity Chamber |
ESPEC | LHU 113 | Humidity Chamber | - |
| 158195 |
|
Palomar 9000 Wedge Bonder |
Palomar | 9000 | Wedge Bonder | - |
| 158194 |
Sold
|
ASML 5500 / 1100 B DUV Stepper (Deep Ultraviolet) |
ASML | 5500 / 1100 B | DUV Stepper (Deep Ultraviolet) | - |