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Plasmatherm Versaline LACVD Etch System
Plasmatherm Versaline LACVD Etch System
Plasmatherm Versaline LACVD Etch System

Plasmatherm Versaline LACVD Etch System

Asset #: 69481

Make: Plasmatherm

Model: Versaline

Wafer Sizes: 6 inch

Last Confirm Date: February 20, 2024

Plasmatherm Versaline LACVD Etch System, 6"
- 2x loadlock Ports
- 2x Process Chambers
- DMC / OCR Reader
- Gases and maximum flows in positions 1 to 8 respectively are:
- CF4 (84 sccm)
- O2 (1000 sccm)
- He (50sccm)
- Ar (50 sccm)
- O2 (50 sccm)
- CHF3 (100 sccm)
- N2 (200 sccm)
- H2 (100 sccm)
- Operating system : Windows 7 Professional SP1 OS
- Tool software: Plasma-Therm Cortex
- OES Software: Plasma-Therm EndpointWorks
- ICP source 2 MHz up to 2000 W with temperature control
- Substrate temperature control via bipolar Johnsen-Rahbek electrostatic chuck
- With backside Helium cooling
CCP source 13.56 MHz up to 600 W
thermally managed chamber liner and pump train
- Optical emission spectroscopy
Single loadlock port:
- 2x Process Chambers: Yes, PM2 & PM3
- DMC / OCR Reader configured for DMC
Gas Configuration"
PM2 Gas
- Gas1Name: "CF4" Gas1Size="84"
- Gas2Name: "O2a" Gas2Size="1000"
- Gas3Name: "He" Gas3Size="50"
- Gas4Name: "Ar" Gas4Size="50"
- Gas5Name: "O2b" Gas5Size="50"
- Gas6Name: "CHF3"
- Gas6Size="100"
- Gas7Name: "N2" Gas7Size="200"
- Gas8Name:"H2" Gas8Size="100"
PM3 Gas
- Gas1Name:"CF4" Gas1Size="84"
- Gas2Name:"O2a" Gas2Size="1000"
- Gas3Name:"He" Gas3Size="50"
- Gas4Name:"Ar" Gas4Size="50"
- Gas5Name:"O2b" Gas5Size="50"
- Gas6Name:"CHF3" Gas6Size="100"
- Gas7Name:"N2" Gas7Size="200"
- Gas8Name:"H2"
- Gas8Size: "100"
- Tool also has an interface for Gas Abatement

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