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Accretech / TSK W-GM-4200 Wafer Edge Grinder
Accretech / TSK W-GM-4200 Wafer Edge Grinder
Accretech / TSK W-GM-4200 Wafer Edge Grinder
Accretech / TSK W-GM-4200 Wafer Edge Grinder
Accretech / TSK W-GM-4200 Wafer Edge Grinder

Accretech / TSK W-GM-4200 Wafer Edge Grinder

Asset #: 146174

Make: Accretech / TSK

Model: W-GM-4200

Wafer Sizes: 8 inch

Last Confirm Date: April 13, 2026

Accretech / TSK W-GM-4200 Wafer Edge Grinder, 8"
- Voltage: AC200V +-5% 3ΓΈ
- Power Consumption: 5.0 KVA
- Main Air Source: 0,56Mpa
- Spindle Air Source: 0,56Mpa
- Grinding and Cleanig Water: 15L/min, 0.3Mpa, 18Β°C recommended
- Mist Exhaust: 5m3/min
- Wafer size: 150mm, 200mm
- Wafer Thickness: 0,4-1,0mm
- Wafer type: Wafer with OF or notch
- Notch Angle: 89deg – 95deg
- Notch Angle Setting Value: 0,001deg step
- Grinding Unit: Left/Right
- Grinding wheel: For Periphery and for Notch
- Periphery Grinding wheel speed: 2500m/min (wheel 200mm, at 4000rpm)
- Rotational Frequency of Spindle for Notch: 70000-94000rpm
- Driving System for Peripheral Grinding: Built-in by inverter motor
- Driving System for Notch Grinding: Air bearing system
- 4 cassette loading stages for wafer size of 6” and 8”
2025 Vintage

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