MRC P 603 Sputtering System, 6"
Control System:
- Mitsubishi PLC Sequencer Control Unit
- Automatic pump-down and playback sequencing
- Automatic flow control system
- Automatic gas pressure control system
Process Chamber:
- Vertical sputtering chamber, 3 target positions + 1 RF etch position
- Chamber material: 1.6 cm stainless steel
- Chamber size: 1765 cm (W) × 177 mm (D) × 584 mm (D)
- Viewports: 6 (with shutters)
- Exhaust ports: 18 cm CF (7-1/8")
Load Lock Chamber
- Type: Two-level load-lock system
- Vacuum seals: Pelos + Viton O-rings
- Drive system: Hydraulic drive
- Pallet movement: Horizontal, 5 positions
Pallets & Transport
- Pallet material: Stainless steel
- Pallet size: 330 × 330 × 8 mm
- Drive: DC motor with tachometer feedback
- Chain-driven closed-loop motion
- Vacuum seals: Magnetic fluid seal + Viton O-ring
- Scan speed range: 2 – 320 cm/min (bi-directional)
Shutter System:
- Material: Stainless steel
- Drive: DC motor chain drive
- Vacuum seal: Magnetic fluid seal + Viton O-Ring
Cathodes (Target Positions 1, 2, 3):
- Type: Planar Magnetron Cathode
- Target size: 120 mm × 378 mm
- Material of body: Oxygen-free copper
- Vacuum seal: Viton seal
- Insulator: Teflon
- Cooling: Water-cooled
RF Etch Station:
- Max power: 1.5 kW RF
- Material: Stainless steel
- Cooling: Water-cooled
- Vacuum seals: Viton + bellows seal
- Etch shield: Quartz glass edge, stainless steel dark-base shield
Power Supplies:
DC Power Supply:
- Max power: 10 kW
- Max voltage: 850 V
- Max current: 25 A
RF Power Supply:
- Rated: 1.5 kW, 13.56 MHz
- Auto-tuning circuits for: Cathodes and Etch station
- Reflected power < 1% of rated
- Traveling wave fluctuation: < 5%
Vacuum System – Process Chamber:
- Cryo pump: CTI Cryo-Torr 8
- Speed: 1500 L/s
- Compressor: Water-cooled compressor
- High-vacuum valve: Air-pressure driven, 18 cm port
- Throttle valve: 19.6 cm port
Vacuum System – Load Lock:
- Coarse pump: ALCATEL rotary pump
- Pumping speed: 760 L/min
- Foreline valve: 3.8 cm port
- Drive: Air-pressure bellows drive
Vacuum Measurement:
- High vacuum: B-A Ion Gauge
- Rough vacuum: Thermocouple (T-C) gauge
- Process gas pressure: MKS Baratron
- Controller: Granville Vacuum Gauge System
Gas System:
- Sputter gas: Argon (99.999%)
- Flow: 50–150 SCCM
- Gas pressure: 0.35–1.05 kg/cm²
- Stainless-steel gas piping
- N₂ purge system
Electrical
- Voltage: 208 V (200 V) 3-phase
- Frequency: 50/60 Hz
- RF power range: 0.3–1.5 kW
- DC power range: 0.3–10 kW
Water Requirements:
System body:
- Flow: 21.0 L/min
- Max inlet pressure: 6.3 kg/cm²
- Min differential pressure: 4.2 kg/cm²
- Temp range: 10–24 °C
Cryo compressor:
- Flow: 9.5 L/min
- Pressure: ≥1.1 kg/cm²
Vacuum Performance:
Process chamber:
- Base pressure: 2×10⁻⁷ Torr
- Pump-down: Atm → 1×10⁻⁶ Torr within 120 minutes
- Leak rate: 2×10⁻⁷ Torr → 1×10⁻⁶ Torr > 20 minutes
Load lock:
- Atm → 1×10⁻⁵ Torr in 8 minutes
2006 Vintage