Hitachi S 9220 CD-SEM (Critical Dimension Scanning Electron Microscope), 12"
- Wafer: Notch
- Length Measurement Method: Cursor & Line Profile Method
- Measuring Range: 0.1 μm ～ 2.0 μm
- Length Measurement Reproducibility: ± 1% or 3 nm (3σ) larger value
- Throughput: Continuous measurement mode 56 wafers / hr
- Length Measurement Reproduction Accuracy: 40k-150k-200k times
- For magnification exceeding 150k times, the effect of electron beam irradiation shall be excluded
Measuring Mode: Automatic & Manual
- Secondary Electron Image Resolution: 3 nm (acceleration voltage 0.8 kV)
Image Magnification:
- Optical Microscope Image: Approx 110 times
- SEM Image: 1k to 300k times
Stage:
- Range of Movement: X-axis: 0-200 mm, Y-axis: 0-200 mm
- Drive System: Pulse Motor Drive
- Control: Computer control, positioning control by linear encoder
- Drive Speed: Max. 100 mm / sec (each X-axis & Y-axis)
Loader System:
- Wafer Carrier -> Loader Room:Automatic transfer by wafer transfer robot
Wafer Transfer Robot:
- Method: Random access type for 2 cassettes
- Wafer Detection in Cassette: Wafer Searcher Built-in
- Chucking Method: Vacuum suction on the back side of the wafer
- OF, V-notch Detection: Automatic detection by optical sensor
Electron Optics:
- Acceleration Voltage: 500 to 1600 V (variable in 10 V steps)
- Lens System: Electromagnetic Lens System, Booster Stock Lens
- Detection System: Scintillator / photomultiplier detector using EXB filter
- 2 stage detection method for SE and BSE images
- Objective Lens Diaphragm: Heated thin film movable pattern (4 holes switching from outside the vacuum) with fine adjustment mechanism
- Scanning Coil: 2-stage electromagnetic deflection
- Astigmatism Correction: 8-pole electromagnetic system (X, Y)
- Prove Current Monitor: Built-in Faraday cup, with automatic measurement function
- Optical Microscope: Approximately 1.2 mm square field of view, with black and white CCD camera
Control / Display System:
- Observation and Control CRT: EWS (GUI) 21-inch CRT
- Combined use of SEM image / optical image display and computer dialogue operation
- Display measurement conditions, wafer map, length measurement value, stage coordinates
- Scanning Mode: TV scan, with auto brightness / contrast function
- Image Processing: Image processing by software using filtering
- Real-time image processing (optional) using DSP
- Image Recording: Video printing device (optional) & image file save function (optional)
- Safety Device: With emergency shutoff switch (mushroom type)
Length Measurement Data Processing:
- File Save Function: Various measurement condition file save function
- Storage Medium: 9G byte hard disk (including for system programs)
- Auxiliary Storage Medium: 3.5-inch magneto-optical disk driver, 3.5-inch F / D driver
- Data Embedding Function: Statistical calculation function using worksheets (mean value, standard deviation, etc.)
- Real-time length measurement value graph display function
- Print Output: 80-digit thermal printer
Vacuum Exhaust System:
- Method: Fully automatic dry clean exhaust system
- Vacuum Pump: 3 ion pumps, Two turbo molecular pumps, 2 dry pumps (supplied)
Supplied Function:
- Protection function in the event of a power outage
- AIR pressure drop
- Cooling water flow rate drop (self) with dynamic valve closing function
- Pump stop function